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PCBA, Microelectronics Industry |
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| Before reflow, the device must ensure that MSD such as BGA, QFP chips, resistors, capacitors components are not damp dry. Otherwise, micro-damage is easily occurred during welding process according to IPC-JSTD-033A. |
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Semiconductor optoelectronics |
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| In Semiconductor and optoelectronic etc. industries, there are a lot of MSD have been used, it should be stored at different levels of low humidity environment according to grade of IC for moisture –proofing. |
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Lens and optical device |
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| Cameras, lenses and other optical devices and drive components of the requirements of humidity are very sensitive to the humidity too high or too low will have equipment damage. |
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