1.IPC-M-109 standard

In order to facilitate more accurate and standardized use of storage for MSD, American Federation of Electronics Industry (IPC) and electronic components Welding Engineering Society (JEDEC) joint research between the developed and issued a standard IPC-M-109 – a manual of moisture-sensitive components of standards and guidance.

IPC-M-109 uniform and revised the two previous standards: IPC-SM-786 and JEDEC-JESD-22-A112. New standard contains many important additions and changes. Moisture-sensitive components on one of the document protection are:

1.IPC/JEDEC J-STD-020 plastic integrated circuit (IC) SMD damp / reflow sensitivity classification:

The document is to help manufacturers to determine the sensitivity of components for moisture and damp. it lists eight kinds of plant floor- life and its classification (floor life). (See table)

LEVEL	FLOOR LIFE
	TLME	CONDITIONS
1	Unlimtcd	≤30℃85%RH
2	1year	≤60℃60%RH
2a	4weeks	≤30℃60%RH
3	168hours	≤30℃60%RH
4	72hours	≤30℃60%RH
5	48 hours	≤30℃60%RH
5a	24hours	≤30℃60%RH
6	Timeon Labei(TOL)	≤30℃60%RH

2.IPC/JEDEC J-STD-033 moisture / reflow sensitive SMD's treatment, packaging, shipment and use of standards.

This document provides recommend ways for treatment, packaging, shipping and the sensitivity of dry and moisture components. Also as a reference in the choice of dry cabinets storing MSD device

Packaging involves drying wet sensitive components and dewetting agent, humidity indicator and humidity-sensitive labels with sealed in moisture-proof bag. Stickers contain about a specific temperature and humidity within the floor-life, packaging body peak temperature (220°C or 235°C), exposure time once bag opened, details regarding to baking condition, baking procedures, and BAG sealing date.

See Table 3-1 Dry Packing Requirements

Level	Dry Before Bag	MBB	Desiccant	MSID*Label	Caution Label
1	Optional	Optional	Optional	Not Required	Not Required if classified at 220 225℃ Required if classified at other than 220 225
2	Optional	Required	Required	Required	Required
2a-5a	Required	Required	Required	Required	Required
6	Optional	Optional	Optional	Required	Required

Please refer to Plan Table 3-1 Dry Packing Requirements

Different package sizes and forms of MSD in different circumstances of floor –life , (see attachment )

Package type and body thickness Moisture sensitivity Level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90%   Body Thickness ≥3.1 mm including PQFPs > 84 pins,PLCCs(square) All MQFPs Or All BGAs ≥ mm Level 2a ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ ∞ 60 78 103 41 53 69 33 42 57 28 36 47 10 14 19 7 10 13 6 8 10 30℃ 25℃ 20℃ Level 3 ∞ ∞ ∞ ∞ ∞ ∞ 10 13 17 9 11 14 8 10 13 7 9 12 7 9 12 5 7 10 4 6 8 4 5 7 30℃ 25℃ 20℃ Level 4 ∞ ∞ ∞ 5 6 8 4 5 7 4 5 7 4 5 7 3 5 7 3 4 6 3 3 5 2 3 4 2 3 4 30℃ 25℃ 20℃ Level 5 ∞ ∞ ∞ 4 5 7 3 5 7 3 4 6 2 4 5 2 3 5 2 3 4 2 2 3 1 2 2 1 2 2 30℃ 25℃ 20℃ Level 5a ∞ ∞ ∞ 2 3 5 1 2 4 1 2 3 1 2 3 1 2 3 1 2 2 1 1 2 1 1 2 1 1 2 30℃ 25℃ 20℃

1. recommendation of moisture-proofing for drying temperature and time(see attachment.)

Package body Thickness	Level	Bake @ 125℃		Bake @ 90℃+5%Rh		Bake @ 40℃+5%Rh
		Saturated@ ℃/85%RH	At Lmit of Floor Life + 72 hr@30℃/60% Rh	Saturated @ 30℃/85%RH	At Lmit of Floor Life + 72 hr@30℃/60% Rh	Saturated@ 30℃/85%RH	At Lmit of Floor Life + 72 hr@30℃/60% Rh
≤1.4mm	2a	5 hours	3 hours	17 hours	11 hours	8 day	5 day
	3	9 hours	7 hours	33 hours	23 hours	13 day	9 day
	4	11 hours	7 hours	37 hours	23 hours	15 day	9 day
	5	12 hours	7 hours	41 hours	24 hours	17 day	10 day
	5a	16 hours	10 hours	54 hours	24 hours	22 day	10 day
≤2.0mm	2a	21 hours	16 hours	3 day	2 day	29 day	22 day
	3	27 hours	17 hours	4 day	2 day	37 day	23 day
	4	34 hours	20 hours	5 day	3 day	47 day	28 day
	5	40 hours	25 hours	6 day	4 day	57 day	35 day
	5a	48 hours	40 hours	8 day	6 day	79 day	56 day